Gold Index: 1131
Suzhou Delphi Laser Co., Ltd [China (Mainland)]
Business Type:Manufacturer, Distributor/Wholesaler Country/Region: China (Mainland)
thick film circuit/thick film integrated circuit/line cutting circuit board
2019-10-30
Laser cutting Ceramic circuit board/Porous ceramic circuit board
Laser cutting(drill)Ceramic circuit board/Porous ceramic circuit board
laser drilling for the Ceramic substrate
drill for the Ceramic substrate/micro drilling of Electronic board/Drill small holes in Ceramic plate
glass special-shaped drilling/High precision glass drilling
Wafer cutting / laser cutting silicon / silicon fine cutting
Sapphire cover lens fine cutting/Sapphire windows cutting
Blue glass / filter special-shaped cutting
crystalline silicon circuit board drilling
crystalline silicon circuit board drilling/Silicon substrate LED drilling
Hard alloy laser drilling
Perforated PCB/small hole drilling of PCB/PCB micro drilling
Drilling of high / low temperature co-fired ceramic
Applications: mobile phone, electronic, machinery
Thin film ceramic microwave circuit scribing / etching
Minimum line width: 0.015mmAccuracy:± 4umLaser processing of high precision, good consistency and reliability, edge effect.
Laser grooving for micro fluids/glass channel scribing
Micro flow control is generally used as a continuous micro- flow liquid source , a wide range of applications in the medical , electronic , military,
Sapphire/glass cover lens fine cutting
ITO etching / coating glass etching
Precision patterned ITO glass , mainly used for electronics, display and R&D.We could offer precision etched ITO films or glass according to custome
custom wafer laser dicing
Laser is an efficient way for silicon or glass wafer dicing, widely apply to semiconductors, MEMS, electronics.