Gold Index: 1131
Suzhou Delphi Laser Co., Ltd [China (Mainland)]
Business Type:Manufacturer, Distributor/Wholesaler Country/Region: China (Mainland)
Deep hole drilling/blind hole drilling
custom
Apply to any material, especially all kinds of metals, ceramics, silicon,sapphireMax depth-diameter ratio: 20:1, 50um holes in 1mm thick materia
2019-10-30
Laser Micro Marking Service
With high speed and precision scan head, laser is able to mark any letter, sign or pattern in most of materials with features of several microns
All Material Ablation Service
With different requirements and applications, we select different lasers to achieve an efficient removing rate with good quality.
stainless steel laser groving
description: metal grove with high end laser machine. not only stainless,but other metal,such as Titanium ain, brass,tungsten,could grove well.
custom wafer laser dicing
Laser is an efficient way for silicon or glass wafer dicing, widely apply to semiconductors, MEMS, electronics.
ITO etching / coating glass etching
Precision patterned ITO glass , mainly used for electronics, display and R&D.We could offer precision etched ITO films or glass according to custome
Sapphire/glass cover lens fine cutting
Laser grooving for micro fluids/glass channel scribing
Micro flow control is generally used as a continuous micro- flow liquid source , a wide range of applications in the medical , electronic , military,
Thin film ceramic microwave circuit scribing / etching
Minimum line width: 0.015mmAccuracy:± 4umLaser processing of high precision, good consistency and reliability, edge effect.
Drilling of high / low temperature co-fired ceramic
Applications: mobile phone, electronic, machinery
Perforated PCB/small hole drilling of PCB/PCB micro drilling
Hard alloy laser drilling
crystalline silicon circuit board drilling
crystalline silicon circuit board drilling/Silicon substrate LED drilling
Blue glass / filter special-shaped cutting
Sapphire cover lens fine cutting/Sapphire windows cutting
Wafer cutting / laser cutting silicon / silicon fine cutting